Description
General
| Model | EBX671-521 |
|---|---|
| Color | Silver |
Expansion Configuration
| PCIe | 2 x Full-size PCI Express Mini Card slot (USB + PCI Express signal) |
|---|---|
| SIM slots | 2 x SIM slot |
| MXM | 1 x MXM3.1 type A connector |
Processor
| CPU | 8th/9th gen Intel Core i7/i5/i3 processors (35W/65W) |
|---|---|
| CPU Socket | LGA1151 |
| Chipset | Q370 |
System Memory
| Standard RAM | 8GB |
|---|---|
| Maximum RAM | 64GB |
| RAM Type | DDR4 |
| RAM Socket | 2 x 260-pin non-ECC SO-DIMM |
Operating System
| Supported Operating Systems | Windows 10 Professional |
|---|
Hard Drive
| SSD | 128 GB SSD |
|---|
System Power
| Power Connection |
1 x Phoenix type VDC power input connector |
|---|---|
| Power Input | 24 VDC |
| Power Protection | OVP (over voltage protection) UVP (under voltage protection) OCP (over current protection) SCP (short circuit protection) Reverse protection |
BIOS
| BIOS Type | AMI |
|---|
Graphics
| GPU Interface | 1 x HDMI, 1 x DP, 1 x DVI-I (2 x DisplayPort via optional MXM kit) |
|---|
USB
| USB 3.1 | 4x USB 3.1 |
|---|---|
| USB 3.0 | 2x USB 3.0 |
I/O
| Ethernet | 4 x PoE (IEEE802.2at), up to 60W; 2 x 10/100/1000 Mbps Ethernet (Intel i210-IT & i219-LM) |
|---|---|
| Serial | 2 x RS-232/422/485 |
| Flexible I/O Window | 1 x Flexible I/O window (Default : 2 x DB9 half-cut bracket) |
System Chassis Characteristics
| Construction | Aluminum Extrusion and Heavy-Duty Steel with IP40 Protection |
|---|---|
| Drive Capacity | 2 x SATA HDD drive bay (max. up 15 mm height & RAID 0 & 1); 1x mSATA |
| Front Panel Indicators | 1 x Green LED for system power-on 1 x Green LED for HDD active 4 x Green LED for programmable |
| Front Panel Controls | 1 x AT/ATX quick switch 1 x ATX power switch 1 x Reset switch 1 x Remote switch |
| Cooling Fans | None |
| TPM | TPM 2.0 |
| Watchdog Timer | 255 levels, 1 ~ 255 sec. |
| Wifi Antennae Port | 4 x SMA-type antenna connector |
| Operating Temperature | Without MXM module: -40°C – 60°C (-40°F to +140°F) (with WT DRAM/SSD, CPU TDP 35W) -40°C – 50°C (-40°F to +122°F) (with WT DRAM/SSD, CPU TDP 65W) With MXM module: -40°C – 50°C (-40°F to +122°F) (with WT DRAM/SSD/ MXM kit, CPU TDP 35W) |
| Shock | IEC 60068-2-27 (with SSD: 50G, half sine, 11 ms duration) |
| Relative Humidity | 10% to 90%, non-condensing |
| Vibration Resistance | IEC 60068-2-64 (with SSD: 3Grms STD, random, 5 – 500 Hz, 1 hr/axis) |
| Weight (Net/Gross) | 4.8 kg (10.58 lb)/5.6 kg (12.34 lb) |
| Dimensions | 280 mm (11.2″) (W) x 210 mm (8.26″) (D) x 80.5 mm (3.16″) (H) |
| Certifications | CE, FCC Class A |
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